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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Ming Chiang Lee

This inventor holds 6 USPTO granted patents. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2010-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming Chiang Lee. Retrieved from https://idiyas.com/inventor/ming-chiang-lee-psknhp47

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6

% Patents Active = 100.0

Average Co-Inventor Count = 5.3

ph-index = 5

Forward Citations = 156(Granted Patents)


Company Filing History:

goldMedal6 out of 1,968 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2010-2016

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6 patents (USPTO):Explore Patents
1. 9406658 - Embedded component device and manufacturing methods thereof (2016-08-02),
2. 9196597 - Semiconductor package with single sided substrate design and manufacturing methods thereof (2015-11-24),
3. 8884424 - Semiconductor package with single sided substrate design and manufacturing methods thereof (2014-11-11),
4. 8569894 - Semiconductor package with single sided substrate design and manufacturing methods thereof (2013-10-29),
5. 8487426 - Semiconductor package with embedded die and manufacturing methods thereof (2013-07-16),
6. 7706149 - Micro-electro-mechanical-system package and method for manufacturing the same (2010-04-27),

Of course! Here is the article about Ming Chiang Lee:

Title: Ming Chiang Lee: Trailblazing Innovator Shaping the Future

Introduction:

Ming Chiang Lee is a visionary inventor based in Kaohsiung, Taiwan, whose relentless pursuit of innovation and unwavering dedication to creating a better future through his inventions have solidified his position as a trailblazer in the world of technology. With a total of 6 patents to his name, Lee's work continues to inspire and shape the landscape of innovation, leaving a lasting legacy for generations to come.

Latest Patents:

Two of Ming Chiang Lee's latest patents are the "Embedded Component Device and Manufacturing Methods Thereof" and the "Semiconductor Package with Single Sided Substrate Design and Manufacturing Methods Thereof." These inventions showcase Lee's expertise in the field of embedded components and semiconductor packaging, highlighting his commitment to pushing the boundaries of technology.

Career Highlights:

Lee is currently associated with Advanced Semiconductor Engineering, Inc. (ASE Inc.), where his innovative spirit and technical prowess have allowed him to thrive in a dynamic industry. His contributions to the company have been invaluable, with his patents serving as a testament to his groundbreaking work in semiconductor technology.

Collaborations:

Throughout his career, Ming Chiang Lee has collaborated with esteemed colleagues such as Yuan-Chang Su and Shih-Fu Huang. Their combined expertise and collective efforts have led to the development of groundbreaking technologies and have cemented Lee's reputation as a leader in the field.

Conclusion:

In conclusion, Ming Chiang Lee's impact on the world of technology is undeniable. His innovative mindset, coupled with his dedication to creating cutting-edge solutions, sets him apart as a true pioneer in his field. As he continues to push the boundaries of what is possible, Lee's legacy will undoubtedly endure, inspiring future generations to continue the pursuit of innovation and excellence.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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