The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2016
Filed:
Dec. 17, 2010
Chun-che Lee, Kaohsiung, TW;
Yuan-chang Su, Luzhu Township, TW;
Ming Chiang Lee, Kaohsiung, TW;
Shih-fu Huang, Zhudong Township, TW;
Chun-Che Lee, Kaohsiung, TW;
Yuan-Chang Su, Luzhu Township, TW;
Ming Chiang Lee, Kaohsiung, TW;
Shih-Fu Huang, Zhudong Township, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaosiung, TW;
Abstract
An embedded component device includes an electronic component including an electrical contact, an upper patterned conductive layer, a dielectric layer between the upper patterned conductive layer and the electronic component, a first electrical interconnect, a lower patterned conductive layer, a conductive via, and a second electrical interconnect. The dielectric layer has a first opening exposing the electrical contact, and a second opening extending from the lower patterned conductive layer to the upper patterned conductive layer. The first electrical interconnect extends from the electrical contact to the upper patterned conductive layer, and fills the first opening. The second opening has an upper portion exposing the upper patterned conductive layer and a lower portion exposing the lower patterned conductive layer. The conductive via is located at the lower portion of the second opening. The second electrical interconnect fills the upper portion of the second opening.