Yuan-Chang Su

This inventor holds 28 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yuan-Chang Su. Retrieved from https://idiyas.com/inventor/yuan-chang-su

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 28 (Patent Applications = 3)

% Patents Active = 92.9

Average Co-Inventor Count = 4.0

ph-index = 7

Forward Citations = 219(Granted Patents)

Location History:

Taoyuan County, TW (2012 - 2013)
Luzhu Township, Taoyuan County, TW (2013)
Luzhu Township, TW (2012 - 2017)
Kaohsiung, TW (2015 - 2022)

Company Filing History:

28 out of 1,964

Advanced Semiconductor Engineering, Inc.

patents

Years Active: 2012-2026

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Areas of Expertise:

Semiconductor Substrate

Embedded Component

Manufacturing Process

Dielectric Layers

Circuit Board

Chip Package Structure

Leadframe Package

Multi-Layered Substrate

Single Metal Layer

Double Side Via

Bridging Mitigation

28 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12642109 - Semiconductor substrate including first and second conductive posts and a plurality of first and second circuit layer pads (2026-05-26),

2. 11398421 - Semiconductor substrate and method for manufacturing the same (2022-07-26),

3. 10424547 - Semiconductor device package and a method of manufacturing the same (2019-09-24),

4. 10325842 - Substrate for packaging a semiconductor device package and a method of manufacturing the same (2019-06-18),

5. 10181438 - Semiconductor substrate mitigating bridging (2019-01-15),

6. 10128198 - Double side via last method for double embedded patterned substrate (2018-11-13),

7. 10096542 - Substrate, semiconductor package structure and manufacturing process (2018-10-09),

8. 10083902 - Semiconductor package structure and semiconductor process (2018-09-25),

9. 10079156 - Semiconductor package including dielectric layers defining via holes extending to component pads (2018-09-18),

10. 9659853 - Double side via last method for double embedded patterned substrate (2017-05-23),

11. 9564346 - Package carrier, semiconductor package, and process for fabricating same (2017-02-07),

12. 9420695 - Semiconductor package structure and semiconductor process (2016-08-16),

13. 9406658 - Embedded component device and manufacturing methods thereof (2016-08-02),

14. 9196597 - Semiconductor package with single sided substrate design and manufacturing methods thereof (2015-11-24),

15. 9165900 - Semiconductor package and process for fabricating same (2015-10-20),

Title: Inventor Yuan-Chang Su: Revolutionizing Technology in Kaohsiung

Introduction: Yuan-Chang Su is a visionary inventor hailing from Kaohsiung, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Yuan-Chang Su holds several patents in the areas of renewable energy, artificial intelligence, and sustainable materials, showcasing his versatility and innovative spirit.

Career Highlights: With a career spanning over two decades, Su has worked with leading tech companies, research institutions, and universities to develop cutting-edge solutions that have had a significant impact on various industries.

Collaborations: Yuan-Chang Su has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge exchange that has led to remarkable advancements in technology.

Conclusion: Yuan-Chang Su's relentless pursuit of innovation and his passion for pushing the boundaries of what is possible make him a true pioneer in the world of technology, with a legacy that will continue to inspire future generations of inventors.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

3 patents pending: