The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2013
Filed:
Mar. 15, 2011
Kay Stephan Essig, Leipzig, DE;
Bernd Karl Appelt, Gulf Breeze, FL (US);
Ming Chiang Lee, Kaohsiung, TW;
Kay Stephan Essig, Leipzig, DE;
Bernd Karl Appelt, Gulf Breeze, FL (US);
Ming Chiang Lee, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaosiung, TW;
Abstract
A semiconductor package includes a conductive base, a die disposed adjacent to an upper surface of the conductive base, a patterned conductive layer, and a dielectric layer encapsulating the die. The dielectric layer defines an opening through which the patterned conductive layer is electrically connected to the upper surface of the conductive base. The conductive base has a lateral surface including a first portion adjacent to the upper surface of the conductive base and a second portion adjacent to a lower surface of the conductive base, where the second portion is sloped inwardly with respect to the lower surface of the conductive base.