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Zhongli, Taiwan

Chia-Cheng Chen

This inventor holds 9 USPTO granted patents. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2012-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Cheng Chen. Retrieved from https://idiyas.com/inventor/chia-cheng-chen-v1dtrbqr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 9

% Patents Active = 100.0

Average Co-Inventor Count = 6.1

ph-index = 5

Forward Citations = 65(Granted Patents)


Location History:

  • Madou Township, TW (2013 - 2015)
  • Zhongli, TW (2012 - 2017)

Company Filing History:

goldMedal9 out of 1,968 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2012-2017

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9 patents (USPTO):Explore Patents
1. 9564346 - Package carrier, semiconductor package, and process for fabricating same (2017-02-07),
2. 9196597 - Semiconductor package with single sided substrate design and manufacturing methods thereof (2015-11-24),
3. 9165900 - Semiconductor package and process for fabricating same (2015-10-20),
4. 8884424 - Semiconductor package with single sided substrate design and manufacturing methods thereof (2014-11-11),
5. 8786062 - Semiconductor package and process for fabricating same (2014-07-22),
6. 8569894 - Semiconductor package with single sided substrate design and manufacturing methods thereof (2013-10-29),
7. 8399776 - Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package (2013-03-19),
8. 8367473 - Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof (2013-02-05),
9. 8288869 - Semiconductor package with substrate having single metal layer and manufacturing methods thereof (2012-10-16),

Title: Pioneering Innovator: Chia-Cheng Chen's Impact on Technological Advancements

Introduction:

Chia-Cheng Chen, based in Zhongli, TW, is a prominent figure in the world of technology, renowned for his relentless drive for innovation and commitment to excellence. With a total of 9 patents to his name, Chen's creative genius has left an indelible mark on the landscape of technological innovation.

Latest Patents:

Among his latest patents is a groundbreaking Package Carrier, Semiconductor Package, and process for fabricating the same. This innovative package carrier includes a dielectric layer, electrically conductive patterns, and posts that revolutionize the semiconductor packaging industry. Additionally, Chen's Semiconductor Package with single-sided substrate design has paved the way for advanced manufacturing methods in the field.

Career Highlights:

Chia-Cheng Chen is a valuable asset to Advanced Semiconductor Engineering, Inc., where his ingenuity and expertise have contributed significantly to the company's success. His work has not only elevated ASE Inc.'s position in the industry but has also demonstrated his prowess as a trailblazer in technology.

Collaborations:

Collaborating closely with esteemed coworkers such as Yuan-Chang Su and Shih-Fu Huang, Chen has been able to leverage collective expertise to push the boundaries of technological possibilities. Their synergistic efforts have led to the development of cutting-edge solutions that have garnered widespread acclaim.

Conclusion:

In conclusion, Chia-Cheng Chen's unwavering dedication to innovation and his remarkable portfolio of patents underscore his status as a true pioneer in the realm of technology. His contributions continue to inspire future generations of inventors and shape the course of technological advancements globally.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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