The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2012
Filed:
Aug. 05, 2010
Applicants:
Yuan-chang Su, Taoyuan County, TW;
Shih-fu Huang, Hsinchu County, TW;
Bernd Karl Appelt, Gulf Breeze, FL (US);
Ming-chiang Lee, Kaohsiung, TW;
Inventors:
Yuan-Chang Su, Taoyuan County, TW;
Shih-Fu Huang, Hsinchu County, TW;
Bernd Karl Appelt, Gulf Breeze, FL (US);
Ming-Chiang Lee, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention directs to fabrication methods of the embedded component package structures by providing preformed lamination structures, joining or stacking the preformed laminate structures and mounting at least one electronic component to the joined structures. By way of the fabrication methods, the production yield can be greatly improved with lower cycle time.