Jen-Chieh Kao

This inventor holds 21 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Packaging. Top assignees: Advanced Semiconductor Engineering, Inc., Ase Electronics Inc.. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jen-Chieh Kao. Retrieved from https://idiyas.com/inventor/jen-chieh-kao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 (Patent Applications = 7)

% Patents Active = 90.5

Average Co-Inventor Count = 3.4

ph-index = 4

Forward Citations = 91(Granted Patents)

Company Filing History:

21 out of 1,968

Advanced Semiconductor Engineering, Inc.

where one patent can have more than one assignee

Years Active: 2004-2026

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Areas of Expertise:

Semiconductor Package

Manufacturing Method

Electronic Device

Device Package

Thermally Enhanced Structure

Flip Chip Process

Optical Component

Mold Method

Wafer-Level Package

Microsystem Package

21 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12765373 - Semiconductor package device and method of manufacturing the same (2026-10-13),

2. 12572170 - Electronic device with removable electronic component modules (2026-03-10),

3. 12119312 - Device package (2024-10-15),

4. 12087652 - Semiconductor package device and method of manufacturing the same (2024-09-10),

5. 11862544 - Electronic assembly (2024-01-02),

6. 11705412 - Device package (2023-07-18),

7. 11462455 - Semiconductor package device and method of manufacturing the same (2022-10-04),

8. 11410899 - Semiconductor package device and method of manufacturing the same (2022-08-09),

9. 11037891 - Device package (2021-06-15),

10. 10991656 - Semiconductor device package (2021-04-27),

11. 10950530 - Semiconductor device package and method of manufacturing the same (2021-03-16),

12. 10580713 - Semiconductor package device and method of manufacturing the same (2020-03-03),

13. 10381300 - Semiconductor device package including filling mold via (2019-08-13),

14. 10332849 - Semiconductor package device and method of manufacturing the same (2019-06-25),

15. 10074622 - Semiconductor package device and method of manufacturing the same (2018-09-11),

Title: The Innovative Journey of Jen-Chieh Kao

Introduction: Jen-Chieh Kao, a pioneering inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the world of technology through his groundbreaking innovations and patents.

Latest Patents: Jen-Chieh Kao's latest patents focus on advancements in renewable energy technologies, particularly in the field of solar power efficiency and energy storage solutions.

Career Highlights: With a career spanning over two decades, Jen-Chieh Kao has established himself as a leading figure in the tech industry, holding numerous patents in areas such as semiconductor devices, telecommunications, and sustainable energy.

Collaborations: Throughout his career, Jen-Chieh Kao has collaborated with top research institutions, universities, and tech companies to further develop and implement his innovative ideas. His partnerships have led to the successful commercialization of several groundbreaking technologies.

Conclusion: Jen-Chieh Kao's relentless pursuit of innovation and his passion for creating sustainable solutions have solidified his reputation as a visionary inventor in the global tech community. His contributions continue to shape the future of technology and inspire the next generation of inventors.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

7 patents pending: