The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Jan. 30, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaosiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01Q 1/38 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/4853 (2013.01); H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/3737 (2013.01); H01L 23/49838 (2013.01); H01L 23/562 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 25/0652 (2013.01); H01Q 1/38 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16157 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/35121 (2013.01);
Abstract
A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the electronic component. The thermal conductive layer includes a plurality of portions spaced apart from each other.