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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10991656 B1

PDFFull Text
Date of Patent:
Apr. 27, 2021

Filed:

Jun. 19, 2019

Semiconductor device package

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Chang-Lin Yeh, Kaohsiung, TW;

Jen-Chieh Kao, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Thao P Le

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5385 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 25/165 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A semiconductor device package includes a first substrate, a second substrate disposed over the first substrate, and a surface mount device (SMD) component disposed between the first substrate and the second substrate. The SMD component includes a plurality of connection electrodes electrically connecting the first substrate to the second substrate, and the plurality of connection electrodes are electrically disconnected from each other.

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Quick Actions:

Yeh, Chang-Lin. (2021). Semiconductor device package (U.S. Patent No. 10991656). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10991656

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