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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12765373 B1

PDFFull Text
Date of Patent:
Oct. 13, 2026

Filed:

Oct. 04, 2022

Semiconductor package device and method of manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Shiu-Fang Yen, Kaohsiung, TW;

Chang-Lin Yeh, Kaohsiung, TW;

Jen-Chieh Kao, Kaohsiung, TW;

Assignee:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Richard A Booth

Int. Cl.
CPC ...
H10W 40/22 (2026.01); H01Q 1/38 (2006.01); H10W 40/25 (2026.01); H10W 42/00 (2026.01); H10W 44/20 (2026.01); H10W 70/02 (2026.01); H10W 70/05 (2026.01); H10W 70/65 (2026.01); H10W 72/00 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H10W 90/20 (2026.01); H10W 90/22 (2026.01);
U.S. Cl.
CPC ...
H10W 40/22 (2026.01); H01Q 1/38 (2013.01); H10W 40/251 (2026.01); H10W 42/121 (2026.01); H10W 44/20 (2026.01); H10W 70/02 (2026.01); H10W 70/093 (2026.01); H10W 70/65 (2026.01); H10W 74/016 (2026.01); H10W 74/117 (2026.01); H10W 90/00 (2026.01); H10W 44/248 (2026.01); H10W 72/884 (2026.01); H10W 90/22 (2026.01); H10W 90/271 (2026.01); H10W 90/288 (2026.01); H10W 90/291 (2026.01); H10W 90/724 (2026.01); H10W 90/725 (2026.01);
Abstract

A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the electronic component. The thermal conductive layer includes a plurality of portions spaced apart from each other.

Find Patent Forward Citations

Yen, Shiu-Fang. (2026). Semiconductor package device and method of manufacturing the same (U.S. Patent No. 12765373). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765373

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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