The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Aug. 14, 2003
Ho-ming Tong, Taipei, TW;
Chun-chi Lee, Kaohsiung, TW;
Jen-kuang Fang, Pingtung Hsien, TW;
Min-lung Huang, Kaohsiung, TW;
Jau-shoung Chen, Hsinchu Hsien, TW;
Ching-huei Su, Kaohsiung, TW;
Chao-fu Weng, Tainan, TW;
Yung-chi Lee, Kaohsiung, TW;
Yu-chen Chou, Kaohsiung, TW;
Ho-Ming Tong, Taipei, TW;
Chun-Chi Lee, Kaohsiung, TW;
Jen-Kuang Fang, Pingtung Hsien, TW;
Min-Lung Huang, Kaohsiung, TW;
Jau-Shoung Chen, Hsinchu Hsien, TW;
Ching-Huei Su, Kaohsiung, TW;
Chao-Fu Weng, Tainan, TW;
Yung-Chi Lee, Kaohsiung, TW;
Yu-Chen Chou, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A solder ball fabricating process for forming solder balls over a wafer having an active layer is provided. A patterned solder mask layer is formed over the active surface of the wafer. The patterned solder mask layer has an opening that exposes a bonding pad on the wafer. Solder material is deposited into the opening over the bonding pad. A reflow process is conducted to form a pre-solder body. The aforementioned steps are repeated so that various solder materials are fused together to form a solder ball over the bonding pad.