The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2004
Filed:
Feb. 20, 2003
Applicant:
Inventors:
Ho-Ming Tong, Taipei, TW;
Chun-Chi Lee, Kaohsiung, TW;
Jen-Kuang Fang, Pingtung Hsien, TW;
Ching-Fu Horng, Penghu, TW;
Shih-Kuang Chen, Kaohsiung, TW;
Shyh-Ing Wu, Kaohsiung, TW;
Chun-Hung Lin, Tainan Hsien, TW;
Yung-Chi Lee, Kaohsiung, TW;
Yu-Chen Chou, Kaohsiung, TW;
Tsung-Hua Wu, Kaohsiung Hsien, TW;
Su Tao, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/5363 ;
U.S. Cl.
CPC ...
B23K 3/5363 ;
Abstract
A solder paste for fabricating bumps includes a flux and metallic alloy powder. The metallic alloy powder includes a plurality of low eutectic metallic alloy granules, and the size of these metallic alloy granules is 20-60 &mgr;m and the average size of the metallic granules is 35 &mgr;m to 45 &mgr;m.