Ching-Fu Horng

Title: Innovations of Ching-Fu Horng

Introduction

Ching-Fu Horng is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor engineering, particularly in the development of advanced circuit board technologies. With a total of 5 patents to his name, Horng continues to push the boundaries of innovation in his industry.

Latest Patents

One of his latest patents is a manufacturing method of a multi-layer circuit board embedded with a passive component. This method involves several steps, including providing a conductive foil with metal protruding points and connecting a passive element to these points. The process also includes stacking the conductive foil with a board that has a core substrate and an organic insulation layer, allowing the passive component to be embedded within the insulation layer.

Another significant patent is for a circuit carrier and its manufacturing process. This circuit carrier consists of a core layer, a passive component, multiple dielectric layers, and circuit layers. The core layer features a hole where the passive component is embedded. The design enhances the electrical performance of the circuit carrier by ensuring that at least one of the circuit layers is electrically connected to the passive component through conductive vias.

Career Highlights

Ching-Fu Horng is currently employed at Advanced Semiconductor Engineering, Inc., where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the capabilities of circuit boards and carriers, making them more efficient and effective for various applications.

Collaborations

Throughout his career, Horng has collaborated with several talented individuals, including Yung-Hui Wang and Ho-Ming Tong. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies in the semiconductor field.

Conclusion

Ching-Fu Horng's contributions to the field of semiconductor engineering are noteworthy. His innovative patents and collaborative efforts continue to shape the future of circuit board technology. His work exemplifies the spirit of innovation that drives progress in the industry.