The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2005
Filed:
May. 03, 2002
Ho-ming Tong, Taipei, TW;
Chun-chi Lee, Kaohsiung, TW;
Jen-kuang Fang, Pingtung Hsien, TW;
Min-lung Huang, Kaohsiung, TW;
Jau-shoung Chen, Hsinchu Hsien, TW;
Ching-huei Su, Kaohsiung, TW;
Chao-fu Weng, Tainan, TW;
Yung-chi Lee, Kaohsiung, TW;
Ho-Ming Tong, Taipei, TW;
Chun-Chi Lee, Kaohsiung, TW;
Jen-Kuang Fang, Pingtung Hsien, TW;
Min-Lung Huang, Kaohsiung, TW;
Jau-Shoung Chen, Hsinchu Hsien, TW;
Ching-Huei Su, Kaohsiung, TW;
Chao-Fu Weng, Tainan, TW;
Yung-Chi Lee, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Raohsiung, TW;
Abstract
A method of forming a bump on an active surface of a wafer is disclosed. The method of the invention forms an under ball metallurgy (UBM) onto the active surface of the wafer. Then, the UBM is partially removed until a portion of the active surface of the wafer is exposed. At least one conductive stud is bonded onto the non-removed UBM by wire bonding.