Kuo-Chung Yee

This inventor holds 15 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2004-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuo-Chung Yee. Retrieved from https://idiyas.com/inventor/kuo-chung-yee-392qgvg4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 15

% Patents Active = 86.7

Average Co-Inventor Count = 2.2

ph-index = 8

Forward Citations = 206(Granted Patents)

Location History:

Taipei, TW (2004 - 2011)
Kaohsiung, TW (2008 - 2012)

Company Filing History:

15 out of 1,971

Advanced Semiconductor Engineering, Inc.

patents

Years Active: 2004-2012

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Areas of Expertise:

Three-Dimensional Package

Stackable Package

Optical Device

Anti-Warp Package

Semiconductor Devices

Micro-Mirror Package

Wafer-Level Package

Molding Method

Photoelectric Device

Microsystem Package

Fabrication Method

Cavity Design

15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8288853 - Three-dimensional package and method of making the same (2012-10-16),

2. 8252629 - Method for making a stackable package (2012-08-28),

3. 8003426 - Method for manufacturing package structure of optical device (2011-08-23),

4. 7741152 - Three-dimensional package and method of making the same (2010-06-22),

5. 7642132 - Three-dimensional package and method of making the same (2010-01-05),

6. 7528053 - Three-dimensional package and method of making the same (2009-05-05),

7. 7456051 - Photoelectric device grinding process and device grinding process (2008-11-25),

8. 7446404 - Three-dimensional package and method of making the same (2008-11-04),

9. 7352071 - Method of fabricating anti-warp package (2008-04-01),

10. 7247267 - Mold and method of molding semiconductor devices (2007-07-24),

11. 7053488 - Micro-mirror package (2006-05-30),

12. 7033914 - Method of making a package structure by dicing a wafer from the backside surface thereof (2006-04-25),

13. 7002257 - Optical component package and packaging including an optical component horizontally attached to a substrate (2006-02-21),

14. 6822324 - Wafer-level package with a cavity and fabricating method thereof (2004-11-23),

15. 6809852 - Microsystem package structure (2004-10-26),

Title: The Innovative Journey of Inventor Kuo-Chung Yee

Introduction: Kuo-Chung Yee, a distinguished inventor hailing from Taipei, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents: Kuo-Chung Yee's latest patents showcase his expertise in areas such as artificial intelligence, renewable energy, and biotechnology, solidifying his position as a pioneer in the industry.

Career Highlights: Throughout his illustrious career, Kuo-Chung Yee has been recognized for his inventive spirit and forward-thinking approach. His inventions have not only revolutionized existing technologies but have also paved the way for new advancements in various sectors.

Collaborations: Kuo-Chung Yee has collaborated with leading research institutions, universities, and tech companies worldwide to further develop and implement his innovative ideas. These partnerships have been instrumental in bringing his inventions to life and making a lasting impact on the industry.

Conclusion: In conclusion, Kuo-Chung Yee's passion for innovation, coupled with his relentless pursuit of excellence, has established him as a trailblazer in the world of technology. His remarkable contributions continue to inspire future generations of inventors and shape the landscape of innovation for years to come.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]