The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2006
Filed:
Aug. 16, 2004
Kuo-chung Yee, Taipei, TW;
Kuo-Chung Yee, Taipei, TW;
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Abstract
The present invention relates to a method of making a package structure by dicing a wafer from the backside surface thereof comprising: (a) providing a first wafer having a active surface, a backside surface and a plurality of scribe lines defining a plurality of chips, wherein each chip has an annular body thereon; (b) dicing the first wafer from the active surface to form a reference coordinate; (c) providing a second wafer; (d) covering and joining the second wafer to the first wafer to form a plurality of cavities; and (e) dicing the corresponding positions of the scribe lines of the first wafer from the backside surface thereof according to the predetermined distance from the reference coordinate so as to form an individual package structure. As a result, the manufacture time is reduced.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile