The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
Nov. 26, 2004
Applicant:
Kuo-chung Yee, Taipei, TW;
Inventor:
Kuo-Chung Yee, Taipei, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract
An anti-warp package comprising a packaging substrate, a chip and a stiffening member is provided. The chip is disposed on a top surface of the packaging substrate. The stiffening member is disposed on a bottom surface of the packaging substrate in a location underneath the surrounding area of the chip. Through the disposition of a stiffening member, warping stress on the packaging substrate when the chip is encapsulated by molding compound is counterbalanced.