The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2006

Filed:

Dec. 31, 2004
Applicant:

Kuo-chung Yee, Taipei, TW;

Inventor:

Kuo-Chung Yee, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A micro-mirror package comprising a substrate, a bottom substrate, a cover substrate, a semiconductor chip, a first adhesive, a second adhesive, a plurality of wires and a lid is provided. The substrate has a circular wall. The bottom substrate is disposed on the substrate within the circular wall. The first adhesive is provided with first spacers for attaching the cover substrate to the semiconductor chip and setting the cover substrate and the semiconductor chip apart. The second adhesive is provided with second spacers for attaching the semiconductor chip to the bottom substrate and setting the semiconductor chip and the bottom substrate apart. The wires are used for electrically connecting the semiconductor chip and the substrate. The lid is disposed on top of the circular wall.


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