The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2004
Filed:
Jan. 28, 2003
Su Tao, Kaohsiung, TW;
Kuo-Chung Yee, Taipei, TW;
Jen-Chieh Kao, Kaohsiung, TW;
Chih-Lung Chen, Kaohsiung, TW;
Hsing-Jung Liau, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A wafer-level package with a cavity includes a chip, a substrate, and a seal member. The chip has a micro device and a plurality of bonding pads electrically connected to the micro device. The substrate has a plurality of through conductive vias corresponding and electrically connected to the bonding pads. Each of the bonding pads on the chip is provided with a conductive bump for electrically connecting the bonding pad to the conductive via. The seal member surrounds the package to form a hermetical cavity. The present invention further provides a method for fabricating the wafer-level package with a cavity.