Company Filing History:
Years Active: 2004
Title: Hsing-Jung Liau: Innovator in Wafer-Level Packaging Technology
Introduction
Hsing-Jung Liau is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on innovative solutions that enhance the efficiency and functionality of micro devices.
Latest Patents
Hsing-Jung Liau's latest patents include a "Wafer-level package with a cavity and fabricating method thereof." This invention features a wafer-level package that consists of a chip, a substrate, and a seal member. The chip contains a micro device and multiple bonding pads that are electrically connected to it. The substrate has several through conductive vias that correspond to the bonding pads, allowing for effective electrical connections. Each bonding pad is equipped with a conductive bump to facilitate this connection. The seal member encases the package, creating a hermetical cavity. Additionally, Liau has developed a "Microsystem package structure," which comprises a substrate, a chip, an adhesive structure, a carrying substrate, a micro-mechanism, wires, an annular body, and a transparent plate. This innovative package structure allows for pressure balance within a closed chamber, enhancing the performance of the micro-mechanism.
Career Highlights
Hsing-Jung Liau is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the field of microsystem packaging, making significant strides in the efficiency and reliability of semiconductor devices.
Collaborations
Liau has collaborated with notable colleagues, including Su Tao and Kuo-Chung Yee, contributing to various projects that aim to innovate and improve semiconductor packaging solutions.
Conclusion
Hsing-Jung Liau's contributions to wafer-level packaging technology exemplify his commitment to innovation in the semiconductor industry. His patents reflect a deep understanding of the complexities involved in micro device packaging, positioning him as a key figure in this field.