The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2024
Filed:
Jul. 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Sheng-Huan Chiu, Taichung, TW;
Chun-Jen Chen, Hsinchu County, TW;
Chen-Shien Chen, Hsinchu County, TW;
Kuo-Chio Liu, Hsinchu, TW;
Kuo-Hui Chang, Taoyuan, TW;
Chung-Yi Lin, Hsinchu, TW;
Hsi-Kuei Cheng, Hsinchu County, TW;
Yi-Jen Lai, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A package includes a die, first conductive structures, second conductive structures, and an encapsulant. The die has a rear surface. The first conductive structures and the second conductive structures surround the die. The first conductive structures include cylindrical columns and the second conductive structures include elliptical columns. At least one of the second conductive structures is closer to the die than the first conductive structures. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures.