Hsinchu, Taiwan

Yi-Jen Lai

USPTO Granted Patents = 35 

Average Co-Inventor Count = 4.9

ph-index = 4

Forward Citations = 68(Granted Patents)


Location History:

  • Chang Hua, TW (2013 - 2022)
  • Hsinchu, TW (2017 - 2024)

Company Filing History:


Years Active: 2013-2025

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35 patents (USPTO):

Title: Innovations and Achievements of Yi-Jen Lai in the Semiconductor Industry

Introduction: Yi-Jen Lai is a prominent inventor based in Hsinchu, Taiwan, with an impressive portfolio of 34 patents. His work primarily revolves around advancements in semiconductor packaging technologies, significantly impacting the performance and efficiency of electronic devices.

Latest Patents: Among his latest innovations are two notable patents: the "Package and Package-on-Package Structure Having Elliptical Columns and Ellipsoid Joint Terminals" and the "Package on Package Structure." The first patent details a comprehensive design involving a die, various conductive structures, and an encapsulant that effectively enhances the arrangement and functionality of semiconductor components. The second patent focuses on a unique package-on-package structure that incorporates conductive bumps and underfill material to optimize the electrical connection between stacked packages, showcasing a substantial improvement in device integration.

Career Highlights: Yi-Jen Lai has dedicated his career to advancing semiconductor technology, particularly during his tenure at Taiwan Semiconductor Manufacturing Company Limited. His innovative contributions are not only pivotal to the development of cutting-edge packaging solutions but also to enhancing the overall performance of semiconductor devices in various applications.

Collaborations: Throughout his career, Yi-Jen has collaborated with esteemed colleagues, including Hsi-Kuei Cheng and Chun-Jen Chen. Together, they have contributed to numerous advancements in semiconductor technology, validating the importance of teamwork and collaboration in achieving groundbreaking innovations.

Conclusion: Yi-Jen Lai's contributions to the field of semiconductor packaging are noteworthy, with 34 patents to his name that demonstrate his commitment to innovation and excellence. His work has paved the way for more efficient electronic devices, and as he continues to push the boundaries of technology, the impact of his inventions will be felt across the industry for years to come.

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