The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Mar. 20, 2018
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Sheng-Huan Chiu, Taichung, TW;
Chun-Jen Chen, Hsinchu County, TW;
Chen-Shien Chen, Hsinchu County, TW;
Kuo-Chio Liu, Hsinchu, TW;
Kuo-Hui Chang, Taoyuan, TW;
Chung-Yi Lin, Hsinchu, TW;
Hsi-Kuei Cheng, Hsinchu County, TW;
Yi-Jen Lai, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A package includes a die, a plurality of first conductive structures, a plurality of second conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The first conductive structures and the second conductive structures surround the die. The first conductive structures include cylindrical columns and the second conductive structures include elliptical columns or conical frustums. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures. The redistribution structure is over the active surface of the die and the encapsulant. The redistribution structure is electrically connected to the die, the first conductive structures, and the second conductive structures.