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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chung-Yi Lin

This inventor holds 32 USPTO granted patents and 7 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Apex Medical Corporation, National Taiwan University. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chung-Yi Lin. Retrieved from https://idiyas.com/inventor/chung-yi-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32 

% Patents Active = 87.5

 

Average Co-Inventor Count = 4.0

ph-index = 6

Forward Citations = 335(Granted Patents)


Location History:

  • Shinying, TW (2006)
  • Hsin-Chu, TW (2006 - 2024)
  • New Taipei, TW (2015 - 2024)
  • Hsinchu County, TW (2015 - 2024)

Company Filing History:

goldMedal29 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 49 
 
Apex Medical Corporation
 patents
bronzeMedal2 out of 1,395 
 
National Taiwan University
 patents
4. 1 out of 1,370 
 
Lite-On Technology Corporation
 patents
where one patent can have more than one assignee

Years Active: 2006-2026

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Areas of Expertise:
Local Interconnect
Electrostatic Discharge Prevention
Memory Device
SRAM Cell
Package Structure
Test Line Structure
Wafer Level Packaging
Flyback Power Converter
Inflation Identification Connector
Heat Stud
Structural Design
Charging Prevention
32 patents (USPTO):Explore Patents
1. 12685116 - Local interconnect (2026-07-14),
2. 12550451 - Electrostatic discharge prevention (2026-02-10),
3. 12507491 - Storage node light shield for pixel of image sensor (2025-12-23),
4. 12438105 - Seal ring structure and method of fabricating the same (2025-10-07),
5. 12334489 - Lthc as charging barrier in info package formation (2025-06-17),
6. 12083284 - Respiratory system (2024-09-10),
7. 12073165 - Standard cell design (2024-08-27),
8. 12051634 - Package and package-on-package structure having elliptical columns and ellipsoid joint terminals (2024-07-30),
9. 11923353 - LTHC as charging barrier in info package formation (2024-03-05),
10. 11894263 - Local interconnect (2024-02-06),
11. 11864369 - Memory device and SRAM cell (2024-01-02),
12. 11756849 - Package and package-on-package structure having elliptical columns and ellipsoid joint terminals (2023-09-12),
13. 11735579 - Electrostatic discharge prevention (2023-08-22),
14. 11688654 - Test line structure, semiconductor structure and method for forming test line structure (2023-06-27),
15. 11404341 - Package and package-on-package structure having elliptical columns and ellipsoid joint terminals (2022-08-02),

Title: The Innovative Journey of Inventor Chung-Yi Lin

Introduction:

Chung-Yi Lin, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations and patents.

Latest Patents:

Chung-Yi Lin's latest patents include advancements in semiconductor technology, renewable energy systems, and artificial intelligence algorithms, showcasing his versatility and forward-thinking approach to invention.

Career Highlights:

Throughout his illustrious career, Chung-Yi Lin has held key positions in leading tech companies, where he spearheaded research and development projects that have resulted in numerous successful patent applications. His expertise in areas such as nanotechnology and telecommunications has set him apart as a visionary in the industry.

Collaborations:

Chung-Yi Lin has collaborated with top research institutions and universities worldwide, fostering a culture of innovation and knowledge exchange. His partnerships have led to the development of cutting-edge technologies that have had a lasting impact on various sectors.

Conclusion:

Inventor Chung-Yi Lin's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a trailblazer in the field. His work continues to inspire future generations of inventors and researchers to think boldly and create solutions that shape the world of tomorrow.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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