Chung-Yi Lin

This inventor holds 32 USPTO granted patents and 7 published patent applications and 1 EPO patent. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Apex Medical Corporation, National Taiwan University. Active years: 2006-2026.

USPTO Granted Patents = 32 (Patent Applications = 7)

% Patents Active = 87.5

EPO Patents = 1 (Patent Applications = 2)

Average Co-Inventor Count = 4.0

ph-index = 6

Forward Citations = 335(Granted Patents)

Location History:

Shinying, TW (2006)
Hsin-Chu, TW (2006 - 2024)
New Taipei, TW (2015 - 2024)
Hsinchu County, TW (2015 - 2024)

Company Filing History:

29 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

2 out of 49

Apex Medical Corporation

patents

2 out of 1,388

National Taiwan University

patents

4. 1 out of 1,355

Lite-On Technology Corporation

patents

where one patent can have more than one assignee

Years Active: 2006-2026

Loading Chart...

Areas of Expertise:

Image Sensor

Seal Ring Structure

Memory Device

SRAM Cell

Electrostatic Discharge Prevention

Semiconductor Device

Flyback Power Converter

Chip-Scale Packaging

Test Line Structure

Structural Design

Patterning Methods

Inflation Identification Connector

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12685116 - Local interconnect (2026-07-14),

2. 12550451 - Electrostatic discharge prevention (2026-02-10),

3. 12507491 - Storage node light shield for pixel of image sensor (2025-12-23),

4. 12438105 - Seal ring structure and method of fabricating the same (2025-10-07),

5. 12334489 - Lthc as charging barrier in info package formation (2025-06-17),

6. 12083284 - Respiratory system (2024-09-10),

7. 12073165 - Standard cell design (2024-08-27),

8. 12051634 - Package and package-on-package structure having elliptical columns and ellipsoid joint terminals (2024-07-30),

9. 11923353 - LTHC as charging barrier in info package formation (2024-03-05),

10. 11894263 - Local interconnect (2024-02-06),

11. 11864369 - Memory device and SRAM cell (2024-01-02),

12. 11756849 - Package and package-on-package structure having elliptical columns and ellipsoid joint terminals (2023-09-12),

13. 11735579 - Electrostatic discharge prevention (2023-08-22),

14. 11688654 - Test line structure, semiconductor structure and method for forming test line structure (2023-06-27),

15. 11404341 - Package and package-on-package structure having elliptical columns and ellipsoid joint terminals (2022-08-02),

Title: The Innovative Journey of Inventor Chung-Yi Lin

Introduction:

Chung-Yi Lin, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations and patents.

Latest Patents:

Chung-Yi Lin's latest patents include advancements in semiconductor technology, renewable energy systems, and artificial intelligence algorithms, showcasing his versatility and forward-thinking approach to invention.

Career Highlights:

Throughout his illustrious career, Chung-Yi Lin has held key positions in leading tech companies, where he spearheaded research and development projects that have resulted in numerous successful patent applications. His expertise in areas such as nanotechnology and telecommunications has set him apart as a visionary in the industry.

Collaborations:

Chung-Yi Lin has collaborated with top research institutions and universities worldwide, fostering a culture of innovation and knowledge exchange. His partnerships have led to the development of cutting-edge technologies that have had a lasting impact on various sectors.

Conclusion:

Inventor Chung-Yi Lin's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a trailblazer in the field. His work continues to inspire future generations of inventors and researchers to think boldly and create solutions that shape the world of tomorrow.