The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

May. 27, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yen-Chun Lin, Hsinchu, TW;

Chung-Yi Lin, Hsinchu County, TW;

Yen-Sen Wang, Hsinchu, TW;

Bao-Ru Young, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); G06F 30/3947 (2020.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); G06F 30/3947 (2020.01); H01L 22/14 (2013.01); H01L 23/528 (2013.01); H01L 24/05 (2013.01);
Abstract

Test line structures are provided. A test line structure includes a semiconductor substrate, a plurality of diagnosis units and a plurality of first micro pad units. The diagnosis units are formed over the semiconductor substrate. Each of the diagnosis units includes a first interconnect structure having a first routing pattern. The first interconnect structures of the diagnosis units are connected in series to form a first test chain through the first micro pad units, and each of the first micro pad units is configured to connect the first interconnect structures of two adjacent diagnosis units in the first test chain. The first routing patterns of the first interconnect structures in the diagnosis units are different.


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