The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

May. 05, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Yen Lian Lai, New Taipei, TW;

Chun Yu Chen, Hsinchu, TW;

Yen-Sen Wang, Hsinchu, TW;

Chung-Yi Lin, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/585 (2013.01); H01L 23/5226 (2013.01); H01L 23/528 (2013.01);
Abstract

A semiconductor structure includes a substrate; a seal ring region around a circuit region over the substrate, wherein the seal ring region includes a sealing region and a transition region, and wherein the transition region is disposed between the sealing region and the circuit region; and a stack of metal layers disposed over the circuit region, the transition region and the sealing region. A metal layer of the stack of metal layers includes metal seal rings disposed in the sealing region including a first section along a first direction and a second section along a second direction, wherein the second direction is substantially perpendicular to the first direction; and metal transition lines disposed in the transition region along the first section and the second section, wherein the metal transition lines are oriented lengthwise along the first direction.


Find Patent Forward Citations

Loading…