The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Feb. 24, 2020
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Sheng-Huan Chiu, Taichung, TW;
Chun-Jen Chen, Hsinchu County, TW;
Chen-Shien Chen, Hsinchu County, TW;
Kuo-Chio Liu, Hsinchu, TW;
Kuo-Hui Chang, Taoyuan, TW;
Chung-Yi Lin, Hsinchu, TW;
Hsi-Kuei Cheng, Hsinchu County, TW;
Yi-Jen Lai, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A package includes a die, a plurality of conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The conductive structures include elliptical columns. The encapsulant encapsulates the die and the conductive structures. The redistribution structure is over the active surface of the die and the encapsulant. The redistribution structure is electrically connected to the die and the conductive structures.