Cheng-Nan Hsieh

Title: Innovations by Cheng-Nan Hsieh

Introduction

Cheng-Nan Hsieh is a notable inventor based in Chubei, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding three patents that showcase his innovative approach to package structures and manufacturing methods.

Latest Patents

One of his latest patents is titled "Package structure with a barrier layer." This patent describes a package structure that includes a first bump structure formed over a first substrate. The first bump structure consists of a first pillar layer and a first barrier layer, with the barrier layer featuring a protruding portion that extends laterally outside the edge of the pillar layer. Additionally, the package structure includes a second bump structure bonded to the first through a solder joint, which is designed to enhance the overall integrity of the package.

Another significant patent is "Method for forming package structure with a barrier layer." This method outlines the process of forming an under bump metallization layer over a metal pad, followed by the application of a photoresist layer. The method includes patterning the photoresist to create an opening and forming a first bump structure over the UBM layer. The process culminates in reflowing the bump structures to establish a solder joint between intermetallic compounds.

Career Highlights

Cheng-Nan Hsieh is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing packaging techniques that are crucial for modern electronics.

Collaborations

Cheng-Nan Hsieh has collaborated with notable colleagues, including Cheng-Hung Chen and Yu-Nu Hsu. Their combined expertise contributes to the innovative projects at their company.

Conclusion

Cheng-Nan Hsieh's contributions to semiconductor packaging through his patents and collaborative efforts highlight his role as a key innovator in the industry. His work continues to influence advancements in technology and manufacturing processes.