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For the Inventor, By the Inventor

Zhubei, Taiwan

Cheng-Hung Chen

This inventor holds 33 USPTO granted patents and 3 published patent applications, primarily in Integrated Circuit Fabrication. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Novatek Microelectronics Corp., Industrial Technology Research Institute. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Hung Chen. Retrieved from https://idiyas.com/inventor/cheng-hung-chen-v5wibjzx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 33 

% Patents Active = 75.8

Average Co-Inventor Count = 5.7

ph-index = 8

Forward Citations = 188(Granted Patents)


Location History:

  • Changhua, TW (2011 - 2015)
  • Hsinchu County, TW (2014 - 2021)
  • Zhubei, TW (2014 - 2022)
  • Tainan, TW (2020 - 2024)

Company Filing History:

goldMedal27 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal5 out of 1,705 
 
Novatek Microelectronics Corp.
 patents
bronzeMedal1 out of 9,308 
 
Industrial Technology Research Institute
 patents

Years Active: 2011-2026

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Areas of Expertise:
Wafer Inspection
Automated Sensor Vehicles
Package Structure
Integrated Circuit
Pattern Density
E-beam Lithography
Rasterizing Circuit Layout
Lithographic Processes
Chip Package
Dynamic Control
Data Processing
Geometric Pattern Verification
33 patents (USPTO):Explore Patents
1. 12675866 - Method and apparatus for inspecting a wafer (2026-07-07),
2. 12153433 - Systems and methods for raised floor automated sensor vehicles (2024-11-26),
3. 11984419 - Package structure with a barrier layer (2024-05-14),
4. 11469203 - Method for forming package structure with a barrier layer (2022-10-11),
5. 11334080 - Systems and methods for raised floor automated sensor vehicles (2022-05-17),
6. 11152238 - Semiconductor processing stage profiler jig (2021-10-19),
7. 11061317 - Method of fabricating an integrated circuit with non-printable dummy features (2021-07-13),
8. 10971386 - Device positioning using sensors (2021-04-06),
9. 10811377 - Package structure with a barrier layer and method for forming the same (2020-10-20),
10. 10811225 - Method of fabricating an integrated circuit with a pattern density-outlier-treatment for optimized pattern density uniformity (2020-10-20),
11. 10431423 - Method of fabricating an integrated circuit with a pattern density-outlier-treatment for optimized pattern density uniformity (2019-10-01),
12. 10359695 - Method of fabricating an integrated circuit with non-printable dummy features (2019-07-23),
13. RE47432 - Output stage circuit (2019-06-10),
14. 10170276 - Method of fabricating an integrated circuit with a pattern density-outlier-treatment for optimized pattern density uniformity (2019-01-01),
15. 9658538 - System and technique for rasterizing circuit layout data (2017-05-23),

Title: Innovations and Contributions of Cheng-Hung Chen

Introduction

Cheng-Hung Chen is a prominent inventor based in Zhubei, Taiwan, with an impressive portfolio of 32 patents. His innovative contributions primarily focus on advancements in automated vehicles and electronic packaging, reflecting his commitment to enhancing technology in these fields.

Latest Patents

Among his latest inventions is a patent for "Systems and methods for raised floor automated sensor vehicles." This system comprises an automated vehicle adept at navigating a predetermined path, equipped with a sensor system that can detect vertical obstacles ahead, allowing it to adjust its route accordingly. Another notable patent is for a "Package structure with a barrier layer," which outlines a method for manufacturing package structures that include advanced bump structures and barrier layers to improve electronic component integration and reliability.

Career Highlights

Cheng-Hung Chen has built a remarkable career in the semiconductor industry. He has contributed his expertise to notable companies such as Taiwan Semiconductor Manufacturing Company Ltd. and Novatek Microelectronics Corporation. In these roles, he has played a vital part in driving innovation and developing cutting-edge technologies.

Collaborations

Throughout his career, Cheng-Hung Chen has collaborated with several talented individuals, including Burn Jeng Lin and Pei-Yi Liu. These partnerships have fostered a creative environment that has led to numerous successful inventions and patents.

Conclusion

Cheng-Hung Chen's dedication to innovation and his significant contributions to technology are evident through his patents and collaborations. His work not only advances the field of automated sensor vehicles but also enhances electronic packaging, marking him as a noteworthy figure in the landscape of modern inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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