Tainan, Taiwan

Yuan-Feng Wu


Average Co-Inventor Count = 13.0

ph-index = 1


Company Filing History:


Years Active: 2020-2024

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3 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Yuan-Feng Wu

Introduction: Yuan-Feng Wu is a notable inventor based in Tainan, Taiwan, recognized for his contributions to semiconductor packaging technologies. With three patents to his name, Yuan-Feng has made significant strides in enhancing package structures and manufacturing methods crucial for modern electronic devices.

Latest Patents: Yuan-Feng Wu's latest patents include pioneering work on package structures with a barrier layer. The first patent focuses on a package structure that comprises a first bump structure formed over a substrate, featuring a barrier layer designed to improve the integrity and performance of the packaging. This structure includes a first protruding portion that extends outside the edge of the first pillar layer, ensuring effective separation from the solder joint. The second patent details a method for forming a package structure with similar innovative features, which incorporates an under bump metallization (UBM) layer and a meticulous process for forming solder joints.

Career Highlights: Yuan-Feng is part of the esteemed team at Taiwan Semiconductor Manufacturing Company Ltd. His work not only contributes to his company's offerings but also plays a vital role in advancing the semiconductor industry. Yuan-Feng's focus on enhancing package structures demonstrates his commitment to improving manufacturing processes and product reliability.

Collaborations: Throughout his career, Yuan-Feng Wu has collaborated with talented individuals like Yu-Nu Hsu and Chun-Chen Liu. These partnerships have led to the development of innovative solutions in semiconductor packaging, showcasing the importance of teamwork in driving technological advancements.

Conclusion: Yuan-Feng Wu's innovative contributions in the field of semiconductor packaging position him as a significant figure in the industry. With a strong foundation of patents and collaborative efforts, he continues to push the boundaries of technology, ensuring greater efficiency and reliability in electronic device manufacturing.

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