For the Inventor, By the Inventor

Enter inventor name

Te-Hsun Pang

USPTO Granted Patents = 11

Average Co-Inventor Count = 10.1

ph-index = 2

Forward Citations = 12(Granted Patents)

Company Filing History:

11 out of 40,635

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2018-2024

Loading Chart...

11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11984419 - Package structure with a barrier layer (2024-05-14),

2. 11855007 - Semiconductor structure (2023-12-26),

3. 11527504 - Conductive external connector structure and method of forming (2022-12-13),

4. 11469203 - Method for forming package structure with a barrier layer (2022-10-11),

5. 11348879 - Semiconductor structure (2022-05-31),

6. 10818612 - Manufacturing method of semiconductor structure (2020-10-27),

7. 10811377 - Package structure with a barrier layer and method for forming the same (2020-10-20),

8. 10741513 - Conductive external connector structure and method of forming (2020-08-11),

9. 10276514 - Semiconductor structure and manufacturing method thereof (2019-04-30),

10. 10163836 - Conductive external connector structure and method of forming (2018-12-25),

11. 9875979 - Conductive external connector structure and method of forming (2018-01-23),

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

Loading…