Tainan, Taiwan

Sen-Chi Chiang


Average Co-Inventor Count = 13.0

ph-index = 1


Company Filing History:


Years Active: 2020-2024

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3 patents (USPTO):Explore Patents

Title: The Innovations of Sen-Chi Chiang: Pioneering Package Structures

Introduction: Sen-Chi Chiang, an inventive mind based in Tainan, Taiwan, has contributed significantly to the field of semiconductor package structures. With a portfolio of three patents, his work exemplifies innovation in manufacturing techniques and materials used in electronic packaging.

Latest Patents: Among his latest inventions, Sen-Chi Chiang holds a patent for a "Package structure with a barrier layer". This innovative package structure features a unique design that enhances the reliability of electronic components. The structure includes a first bump, complete with a pillar layer and a barrier layer, which extends laterally outside the edges, providing robust protection against solder joint failures. Additionally, he has developed a method for forming such package structures, which involves intricate layering techniques, including the formation of an under bump metallization (UBM) layer and precise patterning of photoresist layers. This method lays the groundwork for forming stable solder joints that connect intermetallic compounds between bump structures.

Career Highlights: Sen-Chi currently works at Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leader in the semiconductor fabrication industry. His role at TSMC underscores his importance in advancing packaging technologies that are crucial for the mass production of electronic devices.

Collaborations: Throughout his career, Sen-Chi has collaborated with talented individuals, including coworkers Yu-Nu Hsu and Chun-Chen Liu. Their collective efforts have led to substantial advancements in their field, showcasing the power of teamwork in driving technological innovation.

Conclusion: Sen-Chi Chiang's innovative contributions to the realm of semiconductor package structures not only demonstrate his expertise as an inventor but also highlight the collaborative nature of technological advancements in the electronics industry. His patents pave the way for more reliable and efficient electronic components, reflecting the ongoing evolution of technology.

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