The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Jan. 16, 2014
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Pei-Shan Wu, Yunlin County, TW;
Yi-Ting Hu, Chiayi County, TW;
Ming-Tan Lee, Kaohsiung, TW;
Yu-Lin Wang, Hsinchu County, TW;
Yuh-Sen Chang, Hsinchu County, TW;
Pin-Yi Shin, Hsinchu County, TW;
Wen-Ming Chen, Miaoli County, TW;
Wei-Chih Chen, Hsinchu County, TW;
Chih-Yuan Chiu, Hsinchu County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A bonding apparatus includes a wafer stage, a first chip stage, a first chip transporting device, a second stage and a second chip transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first chip transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second chip transporting device is used for transporting the second chip from the second chip stage onto the wafer.