Taipei, Taiwan

Wei-Chih Chen

This inventor holds 78 USPTO granted patents and 20 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corporation. Active years: 2001-2026.

USPTO Granted Patents = 78 

% Patents Active = 91.0


Average Co-Inventor Count = 2.8

ph-index = 9

Forward Citations = 253(Granted Patents)

Forward Citations (Not Self Cited) = 229(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Ta Chia Cheng, Taichung Hsien, TW (2001)
  • Taichung Hsien, TW (2002)
  • Taichung City, TW (2003)
  • Jhudong Township, TW (2017)
  • Hsinchu County, TW (2019 - 2021)
  • Taipei, CN (2021)
  • Taichung, TW (2002 - 2024)
  • Taipei, TW (2006 - 2024)
  • Hsin-Chu, TW (2012 - 2024)

Company Filing History:


Years Active: 2001-2026

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Areas of Expertise:
Semiconductor Package
Thermal Stress
Dielectric Material
Interconnect Structure
Fan Out Device
Redistribution Layer
Wafer Transport
Integrated Circuit
Resistive Element
Filler-Free Insulation
Decoupling Capacitors
Transport System
78 patents (USPTO):Explore Patents

Title: Trailblazing Inventor: Wei-Chih Chen

Introduction:

Wei-Chih Chen, a visionary inventor based in Taipei, TW, is renowned for his relentless pursuit of innovation and his passion for pushing the boundaries of technology. With an impressive portfolio of 65 patents, Chen has solidified his position as a trailblazer in the world of inventions, inspiring future generations to think creatively and shape the world we live in.

Latest Patents:

1. Method for transporting wafers: Chen's innovative method involves utilizing a wafer transport device with acoustic sensors to measure tensions of belts, thereby determining the inclination of the hoist unit.

2. Package structure comprising buffer layer: Chen's patented package structure includes a buffer layer with a unique Young's modulus designed to reduce thermal stress, enhancing the overall performance and reliability of electronic components.

Career Highlights:

Throughout his illustrious career, Wei-Chih Chen has made significant contributions to the field of technology while working with prominent companies such as Taiwan Semiconductor Manufacturing Company Limited (TSMC). His expertise in semiconductor manufacturing and packaging technologies has been instrumental in driving advancements in the industry.

Collaborations:

Chen's dedication to innovation has been further exemplified through collaborations with talented individuals such as Hung-Jui Kuo and Yu-Hsiang Hu. Together, they have worked on various projects that have led to groundbreaking inventions and patents, showcasing the power of teamwork in driving technological progress.

Conclusion:

In conclusion, Wei-Chih Chen's unwavering commitment to innovation and his pioneering spirit have established him as a true trailblazer in the world of inventions. His groundbreaking patents and collaborations serve as a testament to his dedication to pushing the boundaries of technology and inspiring future inventors to think outside the box. Chen's legacy continues to shape the landscape of technology, leaving a lasting impact on the world we live in.

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