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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12400876 B1

PDFFull Text
Date of Patent:
Aug. 26, 2025

Filed:

Aug. 10, 2023

Methods of manufacture having redistribution layer using dielectric material photoactive component

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Wei-Chih Chen, Taipei, TW;

Yu-Hsiang Hu, Hsinchu, TW;

Hung-Jui Kuo, Hsinchu, TW;

Sih-Hao Liao, New Taipei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co, Ltd., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Michael Jung

Int. Cl.
CPC ...
H01L 21/48 (2006.01); G03F 7/00 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); G03F 7/70 (2013.01); H01L 21/481 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 2224/24147 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/2518 (2013.01); H01L 2924/14335 (2013.01); H01L 2924/1461 (2013.01); H10F 39/809 (2025.01);
Abstract

A passivation layer and conductive via are provided, wherein the transmittance of an imaging energy is increased within the material of the passivation layer. The increase in transmittance allows for a greater cross-linking that helps to increase control over the contours of openings formed within the passivation layer. Once the openings are formed, the conductive vias can be formed within the openings.

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Quick Actions:

Chen, Wei-Chih. (2025). Methods of manufacture having redistribution layer using dielectric material photoactive component (U.S. Patent No. 12400876). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12400876

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