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Sih-Hao Liao

USPTO Granted Patents = 85 (Patent Applications = 36)

Average Co-Inventor Count = 4.4

ph-index = 4

Forward Citations = 94(Granted Patents)

Forward Citations (Not Self Cited) = 55(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hsinchu, TW (2015 - 2024)
New Taipei, TW (2018 - 2024)

Company Filing History:

84 out of 40,850

Taiwan Semiconductor Manufacturing Comp. Ltd.

Tsinghua University

Years Active: 2015-2025

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Areas of Expertise:

Integrated Circuit Package

Semiconductor Package

Manufacturing Method

Dielectric Material

Lithography

Polymer Material

Thermal Stress

Sensing Component

Encapsulant

Filler-Free Insulating Material

Redistribution Layer

Auxiliary Dielectric Portion

85 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12494405 - Fabricating a sensing component encapsulated by an encapsulation layer with roughed surface having a hollow region (2025-12-09),

2. 12476139 - Integrated circuit package and method (2025-11-18),

3. 12469759 - Semiconductor package (2025-11-11),

4. 12412867 - Integrated fan-out package and manufacturing method thereof (2025-09-09),

5. 12412856 - Package structure and method of manufacturing the same (2025-09-09),

6. 12400876 - Methods of manufacture having redistribution layer using dielectric material photoactive component (2025-08-26),

7. 12394741 - Integrated circuit packages having adhesion layers for through vias (2025-08-19),

8. 12334433 - Semiconductor device and method of fabricating the same (2025-06-17),

9. 12322688 - Package structure including auxiliary dielectric portion (2025-06-03),

10. 12315772 - Package and manufacturing method thereof (2025-05-27),

11. 12298667 - Lithography (2025-05-13),

12. 12293988 - Semiconductor package and method of forming the same (2025-05-06),

13. 12265330 - Polymer material in a redistribution structure of a semiconductor package and method of manufacture (2025-04-01),

14. 12249588 - Semiconductor device and methods of manufacture (2025-03-11),

15. 12218009 - Semiconductor package and methods of forming the same (2025-02-04),

Title: The Innovative Journey of Inventor Sih-Hao Liao

Introduction: Sih-Hao Liao, a talented inventor hailing from New Taipei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Sih-Hao Liao holds several patents in the areas of electronics and renewable energy, with his most recent patent focusing on a revolutionary solar panel design that increases energy efficiency by 30%.

Career Highlights: Throughout his illustrious career, Sih-Hao Liao has worked with top research institutions and leading tech companies to develop cutting-edge solutions. His work has been instrumental in advancing the renewable energy sector and enhancing electronic devices' performance.

Collaborations: Sih-Hao Liao has collaborated with renowned engineers and scientists from around the world, fostering a culture of innovation and knowledge sharing. His collaborative projects have resulted in groundbreaking inventions that have shaped the industry.

Conclusion: In conclusion, Sih-Hao Liao's passion for innovation and dedication to pushing the boundaries of technology have established him as a prominent figure in the world of inventions. His relentless pursuit of excellence continues to inspire future generations of inventors and researchers.

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