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For the Inventor, By the Inventor

Taipei, Taiwan

Sih-Hao Liao

This inventor holds 93 USPTO granted patents and 37 published patent applications, primarily in Semiconductor Packaging (CPC class H01L24-19). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., National Tsing Hua University, Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sih-Hao Liao. Retrieved from https://idiyas.com/inventor/sih-hao-liao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 93 

% Patents Active = 98.9

Average Co-Inventor Count = 4.5

ph-index = 5

Forward Citations = 105(Granted Patents)

Forward Citations (Not Self Cited) = 55(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Hsinchu, TW (2015 - 2024)
  • New Taipei, TW (2018 - 2024)

Company Filing History:

goldMedal91 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 1,308 
 
National Tsing Hua University
 patents
bronzeMedal1 out of 465 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2015-2026

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Areas of Expertise:
Die Structure
Package Structure
Thermal Stress
Semiconductor Device
Integrated Circuit
Fan-Out Package
Redistribution Layer
Encapsulation Layer
Lithography
Polymer Material
Sensing Component
Manufacturing Method
93 patents (USPTO):Explore Patents
1. 12702053 - Package structure and method of manufacturing the same (2026-08-04),
2. 12653036 - Semiconductor device and method (2026-06-09),
3. 12642141 - Semiconductor package and manufacturing method thereof (2026-05-26),
4. 12635559 - Semiconductor package and method of forming same (2026-05-19),
5. 12622254 - Package structure and method of forming the same (2026-05-05),
6. 12538808 - Die and package structure (2026-01-27),
7. 12519036 - Semiconductor device and method of forming the same (2026-01-06),
8. 12519024 - Package structure comprising buffer layer for reducing thermal stress and method of forming the same (2026-01-06),
9. 12494405 - Fabricating a sensing component encapsulated by an encapsulation layer with roughed surface having a hollow region (2025-12-09),
10. 12476139 - Integrated circuit package and method (2025-11-18),
11. 12469759 - Semiconductor package (2025-11-11),
12. 12412867 - Integrated fan-out package and manufacturing method thereof (2025-09-09),
13. 12412856 - Package structure and method of manufacturing the same (2025-09-09),
14. 12400876 - Methods of manufacture having redistribution layer using dielectric material photoactive component (2025-08-26),
15. 12394741 - Integrated circuit packages having adhesion layers for through vias (2025-08-19),

Title: The Innovative Journey of Inventor Sih-Hao Liao

Introduction: Sih-Hao Liao, a talented inventor hailing from New Taipei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Sih-Hao Liao holds several patents in the areas of electronics and renewable energy, with his most recent patent focusing on a revolutionary solar panel design that increases energy efficiency by 30%.

Career Highlights: Throughout his illustrious career, Sih-Hao Liao has worked with top research institutions and leading tech companies to develop cutting-edge solutions. His work has been instrumental in advancing the renewable energy sector and enhancing electronic devices' performance.

Collaborations: Sih-Hao Liao has collaborated with renowned engineers and scientists from around the world, fostering a culture of innovation and knowledge sharing. His collaborative projects have resulted in groundbreaking inventions that have shaped the industry.

Conclusion: In conclusion, Sih-Hao Liao's passion for innovation and dedication to pushing the boundaries of technology have established him as a prominent figure in the world of inventions. His relentless pursuit of excellence continues to inspire future generations of inventors and researchers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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