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Hsinchu, Taiwan

Yu-Hsiang Hu

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This inventor holds 191 USPTO granted patents and 80 published patent applications, primarily in Semiconductor Packaging (CPC class H01L23-3128). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd., Imec Vzw. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Hsiang Hu. Retrieved from https://idiyas.com/inventor/yu-hsiang-hu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 191 

% Patents Active = 96.3

Average Co-Inventor Count = 4.1

ph-index = 8

Forward Citations = 418(Granted Patents)

Forward Citations (Not Self Cited) = 299(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Heverlee, BE (2014 - 2015)
  • Hsin-Chu, TW (2014 - 2024)

Company Filing History:

goldMedal187 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents
bronzeMedal2 out of 1,863 
 
Imec Vzw
 patents
4. 1 out of 15 
 
Parabellum Strategic Opportunities Fund LLC
 patents
where one patent can have more than one assignee

Years Active: 2014-2026

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Areas of Expertise:
Semiconductor Package
Thermal Stress
Integrated Circuit
Die Structure
Fan-Out Package
Redistribution Layer
Manufacturing Method
Encapsulation Layer
Dielectric Material
Hollow Region
Sensing Component
Photoactive Component
191 patents (USPTO):Explore Patents
1. 12765352 - Sensor package and method (2026-10-13),
2. 12733509 - Alignment mark via assemblies for a composite interposer and methods of using the same (2026-09-08),
3. 12727491 - Integrated circuit packages and methods of forming the same (2026-09-01),
4. 12702053 - Package structure and method of manufacturing the same (2026-08-04),
5. 12666979 - Semiconductor package and method (2026-06-23),
6. 12653036 - Semiconductor device and method (2026-06-09),
7. 12642141 - Semiconductor package and manufacturing method thereof (2026-05-26),
8. 12635559 - Semiconductor package and method of forming same (2026-05-19),
9. 12622293 - Semiconductor device (2026-05-05),
10. 12622254 - Package structure and method of forming the same (2026-05-05),
11. 12550778 - Semiconductor package and method of forming the same (2026-02-10),
12. 12550777 - Semiconductor device, semiconductor package and manufacturing method thereof (2026-02-10),
13. 12538808 - Die and package structure (2026-01-27),
14. 12519036 - Semiconductor device and method of forming the same (2026-01-06),
15. 12519024 - Package structure comprising buffer layer for reducing thermal stress and method of forming the same (2026-01-06),

Yu-Hsiang Hu is a prolific inventor who has made significant contributions to the semiconductor industry. With over 100 patents to his name, he is a respected figure in the field of packaging technology, with a specific focus on improving the structure and manufacturing processes of semiconductor packages.

Hu's latest patents include a package structure and a method of manufacturing the same, which aims to improve the electrical connections and thermal management of semiconductor dies. The package structure includes a unique surface-modifying film that separates different parts of the package, thereby providing a more robust and reliable solution for semiconductor packaging. Additionally, his another latest patent reveals his understanding of reducing thermal stress in package structure through an innovative buffer layer.

Throughout his career, Hu has worked with several leading technology companies including Taiwan Semiconductor Manufacturing Company Limited and IMEC. At these companies, he has collaborated with colleagues such as Hung-Jui Kuo and Sih-Hao Liao on research and development projects.

Hu's contributions to the semiconductor industry have been significant, and his patents have helped to advance the field of semiconductor packaging in meaningful ways. As one of the leading innovators in this field, he continues to drive innovation and change, thereby creating opportunities for growth and progress in the semiconductor industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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