= 0.57 Inventors with similar research interests:
Location History:
- Heverlee, BE (2014 - 2015)
- Hsin-Chu, TW (2014 - 2024)
Years Active: 2014-2025
Yu-Hsiang Hu is a prolific inventor who has made significant contributions to the semiconductor industry. With over 100 patents to his name, he is a respected figure in the field of packaging technology, with a specific focus on improving the structure and manufacturing processes of semiconductor packages.
Hu's latest patents include a package structure and a method of manufacturing the same, which aims to improve the electrical connections and thermal management of semiconductor dies. The package structure includes a unique surface-modifying film that separates different parts of the package, thereby providing a more robust and reliable solution for semiconductor packaging. Additionally, his another latest patent reveals his understanding of reducing thermal stress in package structure through an innovative buffer layer.
Throughout his career, Hu has worked with several leading technology companies including Taiwan Semiconductor Manufacturing Company Limited and IMEC. At these companies, he has collaborated with colleagues such as Hung-Jui Kuo and Sih-Hao Liao on research and development projects.
Hu's contributions to the semiconductor industry have been significant, and his patents have helped to advance the field of semiconductor packaging in meaningful ways. As one of the leading innovators in this field, he continues to drive innovation and change, thereby creating opportunities for growth and progress in the semiconductor industry.
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