The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Jul. 03, 2024
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Yung-Chi Chu, Kaohsiung, TW;
Hung-Jui Kuo, Hsinchu, TW;
Yu-Hsiang Hu, Hsinchu, TW;
Sih-Hao Liao, New Taipei, TW;
Tian Hu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/58 (2006.01); H10F 39/00 (2025.01); H10F 77/50 (2025.01);
U.S. Cl.
CPC ...
H01L 23/3192 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/3185 (2013.01); H01L 23/481 (2013.01); H01L 23/585 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H10F 39/811 (2025.01); H10F 77/50 (2025.01); H01L 2224/24105 (2013.01); H01L 2224/24155 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82106 (2013.01); H01L 2924/181 (2013.01);
Abstract
A manufacturing method of a semiconductor package includes: laterally covering a sensing die with an encapsulant, where the encapsulant includes a top surface and a rounded inner edge connected to the top surface, and a top surface of the sensing die is lower than the rounded inner edge of the encapsulant and is smoother than the top surface of the encapsulant; and forming a redistribution structure on the top surface of the encapsulant and the top surface of the sensing die.