This inventor holds 373 USPTO granted patents and 109 published patent applications, primarily in Semiconductor Packaging (CPC class H01L23-3128). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd., Parabellum Strategic Opportunities Fund LLC. Active years: 2001-2026.
Inventors with similar research interests:
Location History:
- Taipei, TW (2001)
- Hsinchu, TW (2012 - 2024)
Company Filing History:
369 out of 42,679 
3 out of 437 
1 out of 15 Years Active: 2001-2026
Areas of Expertise:
Title: Hung-Jui Kuo: A Prolific Inventor at Taiwan Semiconductor Manufacturing Company
Introduction:
Hung-Jui Kuo is an accomplished inventor hailing from Hsinchu, Taiwan. Working at Taiwan Semiconductor Manufacturing Company (TSMC), he has made significant contributions to the field of semiconductor packaging and testing. With an impressive portfolio of 255 patents and a focus on innovative solutions, Kuo has emerged as a key figure in propelling technological advancements in the industry.
Latest Patents:
Kuo's recent patents showcase his expertise in developing cutting-edge technologies. One prominent invention is the "Packages with Enlarged Through-Vias in Encapsulant." This package design incorporates a device die, encapsulant, and multiple through-vias that facilitate efficient electrical connections. Notably, Kuo's novel approach utilizes two different sets of through-vias, with the second set being larger and placed outside the first array. This invention offers enhanced performance and opens avenues for further advancements in chip packaging.
Another remarkable patent by Kuo is the "Alignment Holder and Testing Apparatus." This invention introduces an alignment holder designed to securely hold composite specimens used in testing processes. The holder body and innovative positioning mechanism allow for adjustable clamping positions, ensuring accurate test results while optimizing testing efficiency. Kuo's solution addresses a crucial need in the testing domain, demonstrating his commitment to solving real-world challenges.
Career Highlights:
Hung-Jui Kuo has established himself as a leading figure in the semiconductor industry through his numerous contributions. His expertise lies in the areas of semiconductor packaging, testing, and alignment technologies. With an impressive track record of 255 patents, Kuo's work reflects his dedication to advancing the field and improving existing processes.
Collaborations:
Throughout his career, Kuo has worked closely with talented peers who share his passion for innovation. Among his notable collaborators are Yu-Hsiang Hu and Chen-Hua Yu. Collaborative efforts with these individuals have resulted in the development of groundbreaking technologies, which have earned them recognition within the industry.
Conclusion:
Hung-Jui Kuo has proven himself as an exceptional inventor and visionary in the field of semiconductor packaging and testing. With an extensive patent portfolio, Kuo's contributions have played a pivotal role in shaping the advancements in these domains. His latest patents, including the novel through-via package design and the alignment holder for testing apparatus, exemplify his ability to tackle complex challenges with creative and practical solutions. As an integral member of Taiwan Semiconductor Manufacturing Company, Kuo continues to push the boundaries of innovation, further solidifying his position as an influential figure in the industry.