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Hsinchu, Taiwan

Hui-Jung Tsai

USPTO Granted Patents = 78 (Patent Applications = 20)

Average Co-Inventor Count = 3.9

ph-index = 5

Forward Citations = 149(Granted Patents)

Forward Citations (Not Self Cited) = 119(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

78 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2012-2025

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Areas of Expertise:

Semiconductor Packages

Integrated Circuits

Conductive Features

Die Connectors

Photoresist Detection

Adhesion Layers

Through-Vias

Leakage Reduction

Redistribution Layers

Manufacturing Processes

Testing Apparatus

Encapsulant Adhesion

78 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12469757 - Package structure including a die having a taper-shaped die connector (2025-11-11),

2. 12469718 - Dense redistribution layers in semiconductor packages and methods of forming the same (2025-11-11),

3. 12431400 - Packages with enlarged through-vias in encapsulant (2025-09-30),

4. 12381176 - Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer (2025-08-05),

5. 12374627 - Method of fabricating semiconductor structure (2025-07-29),

6. 12362309 - Package structure (2025-07-15),

7. 12315819 - Method of forming RDLs and structure formed thereof (2025-05-27),

8. 12302677 - Semiconductor device and method (2025-05-13),

9. 12176321 - Semiconductor packages and method of forming the same (2024-12-24),

10. 12165985 - Semiconductor device and method (2024-12-10),

11. 12164232 - Method for removing resistor layer, and method of manufacturing semiconductor (2024-12-10),

12. 12148732 - Package structure and method of fabrcating the same (2024-11-19),

13. 12132023 - Integrated circuit, package structure, and manufacturing method of package structure (2024-10-29),

14. 12080609 - Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus (2024-09-03),

15. 12062603 - Semiconductor device having via sidewall adhesion with encapsulant (2024-08-13),

Title: The Innovative Journey of Inventor Hui-Jung Tsai

Introduction: Hui-Jung Tsai, a talented male inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Hui-Jung Tsai holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and creativity.

Career Highlights: Throughout his career, Hui-Jung Tsai has worked with leading tech companies and research institutions, spearheading projects that have pushed the boundaries of innovation. His keen eye for detail and passion for problem-solving have led to the development of cutting-edge solutions that have revolutionized various industries.

Collaborations: Hui-Jung Tsai has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing. His collaborative efforts have resulted in the successful implementation of novel technologies that have had a lasting impact on society.

Conclusion: In conclusion, Hui-Jung Tsai's relentless pursuit of innovation and his dedication to pushing the limits of technology have solidified his reputation as a visionary inventor. His work continues to inspire future generations of inventors and researchers to think outside the box and create a better tomorrow.

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