Company Filing History:
Years Active: 2020-2025
Title: Yung-Chi Chu: Innovator in Semiconductor Packaging
Introduction
Yung-Chi Chu is a prominent inventor based in Kaohsiung, Taiwan, with a remarkable portfolio that includes 19 patents. His work primarily focuses on semiconductor packaging technologies, which play a significant role in the electronics industry, enhancing the performance and reliability of various devices.
Latest Patents
Among his latest contributions, Yung-Chi has developed innovative package structures and methods of manufacturing. One notable patent describes a package structure that incorporates a semiconductor die along with a first redistribution circuit structure. This structure features a build-up layer containing a metallization layer and a dielectric layer, which optimally wraps the metallization layer. This design allows a portion of the metallization layer to protrude from the dielectric layer, contributing to improved electrical connectivity.
Another significant patent explores a package structure composed of multiple semiconductor dies. It outlines the use of an insulating encapsulant and a redistribution layer that enhances the connections between the semiconductor dies. Each die includes a semiconductor substrate equipped with conductive pads and posts, along with alignment marks that ensure precise manufacturing. This innovation is essential for advancing packaging technology and improving device performance.
Career Highlights
Yung-Chi Chu currently works at Taiwan Semiconductor Manufacturing Company Ltd., a leading organization in the semiconductor field. His extensive experience in this innovative environment has allowed him to contribute significantly to the development of state-of-the-art packaging techniques.
Collaborations
Throughout his career, Yung-Chi has collaborated with talented coworkers, including Hung-Jui Kuo and Yu-Hsiang Hu. These collaborations highlight the importance of teamwork in driving innovation within the semiconductor industry.
Conclusion
Yung-Chi Chu's contributions to semiconductor packaging through his inventions and patents reflect his dedication to enhancing technology. His work not only demonstrates his inventive spirit but also signifies the ongoing advancements in the electronics sector. With his continued efforts, Yung-Chi is set to further influence the evolution of semiconductor technologies.