The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Sep. 03, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Jhih-Yu Wang, New Taipei, TW;
Hung-Jui Kuo, Hsinchu, TW;
Yu-Hsiang Hu, Hsinchu, TW;
Sih-Hao Liao, New Taipei, TW;
Yung-Chi Chu, Kaohsiung, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
An integrated fan-out (InFO) package includes a die, a plurality of conductive structures aside the die, an encapsulant laterally encapsulating the die and the conductive structure, and a redistribution structure. The redistribution structure is disposed on the encapsulant. The redistribution structure includes a plurality of routing patterns, a plurality of conductive vias, and a plurality of alignment marks. The routing patterns and the conductive vias are electrically connected to the die and the conductive structures. The alignment marks surround the routing patterns and the conductive vias. The alignment marks are electrically insulated from the die and the conductive structures. At least one of the alignment marks is in physical contact with the encapsulant, and vertical projections of the alignment marks onto the encapsulant have an offset from one another.