Jhih-Yu Wang

Title: Innovations by Jhih-Yu Wang: A Leader in Semiconductor Packaging

Introduction

Jhih-Yu Wang is an esteemed inventor based in New Taipei, Taiwan, renowned for his significant contributions to the field of semiconductor technology. With an impressive portfolio of 13 patents, he has made substantial advancements in packaging structures and fabrication methods that enhance electronic device performance.

Latest Patents

Jhih-Yu Wang’s latest innovations include two noteworthy patents. The first, titled "Package structure and method of fabricating the same," involves a groundbreaking package structure comprising multiple semiconductor die, an insulating encapsulant, and a redistribution layer. Each semiconductor die is equipped with a conductive substrate and alignment marks, ensuring precise fabrication and performance. The insulating encapsulant effectively encapsulates the semiconductor dies, while the redistribution layer connects electrically, facilitating improved functionality.

The second patent, "Semiconductor package and manufacturing method thereof," outlines an innovative packaging technique that features a die enveloped by an encapsulant and a redistribution structure on its active surface. This structure consists of a conductive via, routing patterns, and a dual-layer seal ring design that enhances the electrical connection and reliability of the semiconductor package.

Career Highlights

Jhih-Yu Wang is currently affiliated with Taiwan Semiconductor Manufacturing Company Limited, a global leader in semiconductor manufacturing. His work focuses on advancing packaging technologies that support the burgeoning demands of the electronics industry. His dedication to innovation has positioned him as a key figure in the semiconductor landscape.

Collaborations

During his career, Jhih-Yu Wang has collaborated with talented individuals such as Hung-Jui Kuo and Yu-Hsiang Hu. These partnerships have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies in semiconductor packaging.

Conclusion

Jhih-Yu Wang’s contributions to semiconductor packaging through his patents underscore his role as a pioneering inventor in the industry. His innovative approaches continue to influence the field, establishing new benchmarks for performance and reliability in electronic devices. As technology evolves, his work will undoubtedly remain significant in shaping the future of semiconductor manufacturing.