The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Jul. 19, 2023
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Yung-Chi Chu, Kaohsiung, TW;
Hung-Jui Kuo, Hsinchu, TW;
Yu-Hsiang Hu, Hsinchu, TW;
Sih-Hao Liao, New Taipei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); C08G 73/22 (2006.01); C08K 5/134 (2006.01); C08L 33/24 (2006.01); C08L 79/08 (2006.01); H01L 21/768 (2006.01); H01L 23/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/31 (2013.01); C08G 73/22 (2013.01); C08K 5/1345 (2013.01); C08L 33/24 (2013.01); C08L 79/08 (2013.01); H01L 21/76802 (2013.01); H01L 23/16 (2013.01);
Abstract
A package includes a die, an encapsulant, and a redistribution structure. The encapsulant laterally encapsulates the die. The redistribution structure is over the die and the encapsulant. The redistribution structure partially exposes the die. A top surface of the redistribution structure is slanted downward continuously from an edge of the package toward an interior of the package.