Chien-Pin Chan

This inventor holds 9 USPTO granted patents and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2025.

USPTO Granted Patents = 9 (Patent Applications = 1)

% Patents Active = 100.0

Average Co-Inventor Count = 7.6

ph-index = 1

Forward Citations = 5(Granted Patents)

Company Filing History:

9 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2013-2025

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12431365 - Bump structure and method of making the same (2025-09-30),

2. 12033870 - Bump structure and method of making the same (2024-07-09),

3. 11527504 - Conductive external connector structure and method of forming (2022-12-13),

4. 11417539 - Bump structure and method of making the same (2022-08-16),

5. 10741513 - Conductive external connector structure and method of forming (2020-08-11),

6. 10163836 - Conductive external connector structure and method of forming (2018-12-25),

7. 9875979 - Conductive external connector structure and method of forming (2018-01-23),

8. 8952534 - Semiconductor device and semiconductor assembly with lead-free solder (2015-02-10),

9. 8610270 - Semiconductor device and semiconductor assembly with lead-free solder (2013-12-17),

Title: The Innovative Mind of Chien-Pin Chan

Introduction

Chien-Pin Chan, a notable inventor hailing from Pingzhen, Taiwan, has made significant contributions to the field of semiconductor technology. With 8 patents to his name, Chan has demonstrated his expertise and creativity in developing innovative solutions that advance the semiconductor industry.

Latest Patents

Among his latest patents, Chan has introduced a method for creating a bump structure in semiconductor devices. This method involves forming conductive layers over a substrate, utilizing photoresist layers for precise etching, and finally creating a robust bump structure that enhances electrical connections. Additionally, Chan has patented a technique for forming external electrical connectors, which includes a meticulous process of plating pillars and solder to ensure reliable connections in semiconductor applications.

Career Highlights

Chien-Pin Chan currently works at Taiwan Semiconductor Manufacturing Company Ltd., where he applies his extensive knowledge to push the boundaries of semiconductor manufacturing. His innovative approaches have not only advanced the production techniques but have also helped in enhancing the performance and reliability of semiconductor devices.

Collaborations

Throughout his career, Chan has collaborated with talented individuals such as Meng-Fu Shih and Chun-Yen Lo. These partnerships have fostered a dynamic exchange of ideas and have played a vital role in the successful execution of complex projects in the semiconductor domain.

Conclusion

Chien-Pin Chan’s contributions to the semiconductor industry exemplify the power of innovation and teamwork. As he continues to develop new technologies, his work will undoubtedly shape the future of semiconductor manufacturing and inspire future inventors to explore the potential of new ideas.