The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2013
Filed:
Feb. 09, 2010
Applicants:
Yi-jen Lai, Chang Hua, TW;
Chih-kang Han, Hsinchu, TW;
Chien-pin Chan, Pingzhen, TW;
Chih-yuan Chien, Zhubei, TW;
Huai-tei Yang, Hsinchu, TW;
Inventors:
Yi-Jen Lai, Chang Hua, TW;
Chih-Kang Han, Hsinchu, TW;
Chien-Pin Chan, Pingzhen, TW;
Chih-Yuan Chien, Zhubei, TW;
Huai-Tei Yang, Hsinchu, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device includes a bump structure over a pad region. The bump structure includes a copper layer and a lead-free solder layer over the copper layer. The lead-free solder layer is a SnAg layer, and the Ag content in the SnAg layer is less than 1.6 weight percent.