The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Jul. 22, 2004
Chia-jen Cheng, Taoyuan, TW;
Hui-mei Yu, Hsinchu Hsien, TW;
Li-hsin Tseng, Taichung, TW;
Tzu-han Lin, Hsinchu, TW;
Ching-chiang Wu, Taichung Hsien, TW;
Chun-yen Lo, Taichung, TW;
Li-chuan Huang, Taipei, TW;
Boe Su, Chiayi, TW;
Chia-Jen Cheng, Taoyuan, TW;
Hui-Mei Yu, Hsinchu Hsien, TW;
Li-Hsin Tseng, Taichung, TW;
Tzu-Han Lin, Hsinchu, TW;
Ching-Chiang Wu, Taichung Hsien, TW;
Chun-Yen Lo, Taichung, TW;
Li-Chuan Huang, Taipei, TW;
Boe Su, Chiayi, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A method for fabricating a pad redistribution layer. First, at least one bonding pad exposed by a first passivation layer is provided. A diffusion barrier layer and a seed layer are then formed over the first passivation layer and the bonding pad. A patterned mask layer is then formed over the seed layer to expose a portion thereof over the bonding pad, and a metal layer is then formed thereon. A sacrificial layer is then formed over the substrate and the sacrificial layer over the patterned mask layer is removed. The conductive film exposed by the metal layer and the remaining sacrificial layer is then removed, leaving a pad redistribution layer for the bonding pad.