Ching-Chiang Wu

Title: Innovations of Ching-Chiang Wu in Semiconductor Technology

Introduction

Ching-Chiang Wu is a notable inventor based in Taichung Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the fabrication of pad redistribution layers. His innovative methods have the potential to enhance the efficiency and performance of electronic devices.

Latest Patents

Wu holds a patent for a "Method for fabricating pad redistribution layer." This method involves several steps, starting with providing at least one bonding pad exposed by a first passivation layer. A diffusion barrier layer and a seed layer are then formed over the first passivation layer and the bonding pad. Following this, a patterned mask layer is created over the seed layer to expose a portion of it over the bonding pad, and a metal layer is subsequently formed. A sacrificial layer is then applied over the substrate, and the sacrificial layer over the patterned mask layer is removed. Finally, the conductive film exposed by the metal layer and the remaining sacrificial layer is removed, resulting in a pad redistribution layer for the bonding pad.

Career Highlights

Ching-Chiang Wu is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing the technology used in modern electronics.

Collaborations

Wu has collaborated with talented individuals such as Chia-Jen Cheng and Hui-Mei Yu, who contribute to the innovative environment at their workplace.

Conclusion

Ching-Chiang Wu's contributions to semiconductor technology, particularly through his patented methods, highlight his role as an influential inventor in the field. His work continues to impact the development of advanced electronic devices.