Company Filing History:
Years Active: 2006
Title: Hui-Mei Yu: Innovator in Semiconductor Fabrication
Introduction
Hui-Mei Yu is a notable inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of semiconductor fabrication, particularly through his innovative methods.
Latest Patents
Hui-Mei Yu holds a patent for a "Method for fabricating pad redistribution layer." This method involves several steps, including providing at least one bonding pad exposed by a first passivation layer. A diffusion barrier layer and a seed layer are then formed over the first passivation layer and the bonding pad. A patterned mask layer is created over the seed layer to expose a portion thereof over the bonding pad, followed by the formation of a metal layer. A sacrificial layer is then formed over the substrate, and the sacrificial layer over the patterned mask layer is removed. Finally, the conductive film exposed by the metal layer and the remaining sacrificial layer is removed, resulting in a pad redistribution layer for the bonding pad.
Career Highlights
Hui-Mei Yu is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work has contributed to advancements in the manufacturing processes that are crucial for modern electronics.
Collaborations
Hui-Mei Yu has collaborated with talented coworkers, including Chia-Jen Cheng and Li-Hsin Tseng, who have also made their mark in the field of semiconductor technology.
Conclusion
Hui-Mei Yu's innovative methods in semiconductor fabrication highlight his expertise and commitment to advancing technology. His contributions continue to influence the industry and pave the way for future innovations.