Li-Chuan Huang

Title: Innovations by Li-Chuan Huang in Semiconductor Fabrication

Introduction

Li-Chuan Huang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor fabrication, particularly through his innovative methods that enhance the efficiency and effectiveness of electronic components.

Latest Patents

Li-Chuan Huang holds a patent for a "Method for fabricating pad redistribution layer." This method involves several steps, starting with providing at least one bonding pad exposed by a first passivation layer. A diffusion barrier layer and a seed layer are then formed over the first passivation layer and the bonding pad. Following this, a patterned mask layer is created over the seed layer to expose a portion of it over the bonding pad, and a metal layer is subsequently formed. A sacrificial layer is then applied over the substrate, and the sacrificial layer over the patterned mask layer is removed. Finally, the conductive film exposed by the metal layer and the remaining sacrificial layer is removed, resulting in a pad redistribution layer for the bonding pad.

Career Highlights

Li-Chuan Huang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on advancing technologies that are crucial for modern electronics.

Collaborations

Li-Chuan Huang collaborates with talented individuals such as Chia-Jen Cheng and Hui-Mei Yu, who contribute to the innovative environment at their workplace.

Conclusion

Li-Chuan Huang's contributions to semiconductor fabrication through his patented methods demonstrate his expertise and commitment to innovation in the field. His work continues to influence the development of advanced electronic components.